TSMC7 claims to direct against 65 nanometers on day, 40 nanometers and 28 nanometers craft put out already integrated multiple electronic design automation that can be operated alternately (Electronic Design Automation; EDA) Technological file. These technological file suit including technological design kit (iPDK) that can be interflowed correlated with designing , craft design rule checking (iDRC) , the integrated circuit overall arrangement contrasts with circuit diagram (iLVS) ,And craft capacitor and resistor collects the die set (iRCX) .
IPDK, iDRC, iLVS, it is passed and verified under the intercommunication project of the semi-conductive industry with EDA cooperative partner together by TSMC and iRCX is technological, also a part of TSMC ' opens the innovative platform '.
It is complicated for the craft of the advanced semi-conductive manufacturing technology to opposite to design rule, and need and perfect description more carefully, could make the chip design accomplish accurate circuit overall arrangement and simulation, and can do well proving and analyze after the overall arrangement is finished. TSMC has accorded with the form built up and can be interflowed unanimously that the master EDA ecosystem partner defines TSMC craft demand of coinciding with development together, these partners are the members of the intercommunication project of our company ' open the innovative platform ', they not only support the new form in the design software also verify the reliability that the real chip produces, and this authentication procedure can remove the nonconformity of the materials, reduces the verification time of the software and increases the reliability designed.
TSMC, system development partner Mentor Company and common development of Synopsys Company are first 40 nanometers of iDRC and iLVS, and prove with quality assurance the partner Magma Company proves with Cadence Company together at the same time. In addition,TSMC too and system development partner and Synopsys Company and Ciranova Company common development iPDK of first 65 nanometers, and and prove with quality assurance the partner Magma Company proves with Springsoft Company together. The above-mentioned two technological files that can be interflowed have been offered for the customer to verify successively since last July. After extensive test, 65 nanometers of iPDK, 40 nanometers of iPDK, and 65 nanometers and 40 nanometers iDRC and iLVS, it has been already ready to be for batch productino to design.
TSMC 65 nanometers of intact iRCX technological file has already been used in the batch productino design at the beginning of 2009, joining with 28 nanometers of iRCXs 40 nanometers the file at present.
TSMC designs the constitute to be on sale throughout the few specially reputable division chiefs in the place village to represent: ' TSMC can develop and verify the general EDA form with EDA supplier's partner together, the ones that accelerated the materials and transmitted and guaranteed technical data of the advanced craft are intact and errorless. The newest iPDK, iDRC, iLVS and iRCX technological file has already included in the Er early customer's test stage in the valuable opinion of customer and ecosystem partner, and ready to offer batch productino to design. New integrated the intersection of EDA and the intersection of materials and form let artificer can choice easily pass the intersection of EDA and software that prove already, so not only the ability that the design requirement, promotion which accord with the artificer are conforming to TSMC craft, and can guarantee to design accuracy grade to step aside, artificer's design for the first time succeeds promptly. '
Listing time course
65 nanometers of iPDK of TSMC have already been listed, and 40 nanometers of iPDK, 65 nanometers are expected to put out with 40 nanometers iDRC and iLVS, and iRCX file of 28 nanometers in the second quarter of 2010. It is relevant and technological for file and can general for EDA form software result of proving but at design entry website http://online.tsmc.com/online/ inquiry, customer of TSMC Online, or each customer manager who arranges with TSMC finds out about the details.
TSMC opens the innovative platform
It last innovation TSMC platform (Open Innovation Platform&trade) Tie in the chip design industry, TSMC designs silicon intellectual property right of ecosystem cooperative partner and TSMC, the chip design, with accelerating innovating immediately during designformanufacturability service, technology and rear-stage encapsulation testing service. It has a design ecosystem interface of a plurality of intercommunication and by TSMC and composition key element which the cooperative partner develops in coordination, these is committed key element department to initiate or offer voluntarily by TSMC and support. See through these interfaces and primary elements, can accelerate the innovation of each link of whole semi-conductive industry supply chain more efficiently, and impel the whole industry and create and share more value. In addition, AAA - precise certainly card mechanism (Active Accuracy Assurance Initiative) voluntarily of TSMC It is another important key opened in the innovative platform, can guarantee above-mentioned interface and precision and quality of the primary element.
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Keith Farren
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